CEALeti offers stateoftheart technology bricks to enable 3D high performance applications: computing, telecommunication, photonics, RF and heterogeneous technologies.

From design to fabrication and electrical characterization, CEALeti offers various hybrid bonding solutions using full 300&200mm fabrication lines including Known Good Dies:

Wafertowafer and dietowafer bonding technologies
Multilayer hybrid bonding techniques with fine connection pitches ( below 1μm) to support various technologies with high bandwidth
Merging bonding techniques and modules for next generation of ultrafine die alignment ( below 200nm)

#HybridBonding #3D #packaging

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