Highperformance and power efficiency needs of emerging workloads demand onpackage integration of heterogeneous processing units, memory, and electrical and optical interconnects. Applications such as artificial intelligence, machine learning, data analytics, 5G, automotive, and highperformance computing are driving these demands to meet the needs of cloud computing, intelligent edge, enterprise, client, and handheld computing infrastructure. Onpackage interconnects are a critical component to deliver powerefficient performance with the right feature set in this evolving landscape. UCIe is an open industry standard with a fully specified stack that comprehends plugandplay interoperability of chiplets on a package; similar to the seamless interoperability on board with wellestablished and successful offpackage interconnect standards such PCI Express, Universal Serial Bus (USB), and Compute Express Link (CXL).

In this tutorial, UCIe experts and spec developers will:
• discuss the usages and key metrics of UCIe
• delve into electrical, packaging, protocol, RAS, and software aspects along with the compliance and interoperability mechanisms.

Learn more: www.uciexpress.org