TSMC is celebrating 30 years of the North America Tech Symposium, and this year they have a ton of announcements. Headlining is A16, the process node beyond TSMC N2, featuring Super Power Rail technology. We also have new packaging in SystemonWafer, enabling wafer scale like designs similar to Tesla Dojo, and there's also COUPE, TSMC's new optical copackaging technology. At the Symposium, the key focus was to enable new AI technologies.

[00:00] SYMP... OSIUM
[00:50] A16 + Super Power Rail
[02:38] SystemonWafer
[04:18] COUPE Optical CoPackaging
[06:19] Go to the symposium!


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