Thermal considerations when designing hardware and PCBs. Including discussions on trace widths, planes, copper thickness, power calculations, regulator and package choice, and more.
[SUPPORT]
Free trial of Altium Designer: https://www.altium.com/yt/philslab
Patreon: / phils94
Mixedsignal hardware design course: https://philslabshop.fedevel.education
Advanced Hardware Design Course Survey
https://forms.gle/X4jwvtZeJ1jTXh7r9
[GIT]
https://github.com/pms67
[LINKS]
Instagram: / philslabyt
[TIMESTAMPS]
00:00 Introduction
00:37 Altium Designer Free Trial
01:16 Trace/Plane Width and Thickness
02:41 IPC2221 Calculator
06:07 Paralleling Layers
07:03 LDO Power Dissipation
09:42 Package Choice (Thermal Resistance)
13:15 Thermal Vias and Pads
17:59 Thermal Reliefs and Copper Balancing
18:55 Summary
20:42 Outro